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  • Wire Bonder(WESTBOND,747677E)

Standard Specifications

1. Wire bond( Wedge bonding, Ball Bonding, Ribbon Bonding)

2. Microscope : 15X(eyepiece)

3. Temperature controller and heated work holder

4. Temperature controller : room to 300 degree

5. Wire feed angle : 45°, 90°

6. Data Entry : Selector Switch

7. Control Logic : Motorola 68000 Microprocessor

8. Memory : Battery back-up RAM(256KB)

9. Display : 4-Line, 40-Character LCD

10. Device Storage : 30 Buffers

11. Z Tool Range : 0.5 inch

12. Z Encoder Resolution : 0.002 inch

13. Bond Force Range : Adjustable, 10 to 250 grams

14. Transducer : 1/2 wave, 63 KHZ(nominal)

15. Ball Fault Detection

16. Ultrasonics : Built-in, 8 bit, 4 watts( Ultrasonic Positioning Utility)

17. Wire Range : 0.7 to 2 mils, 1x10 gold ribbon

18. ESD Protection : Protection against Electrostatic Discharge

19. Conventional Tool Length : 0.750 inch

20. Deep Access Tool Length : 0.750 inch

21. Ball Capillary Length : 0.625 inch or 0.750 inch

22. Micromanipulator : Dual Counterbalanced, Single level, 8:1 ratio

23. Wire Spool Mount : 2" spool (Option-0.5 inch with ball bearing roller)

24. Radiant Tool Heat : Built-in

25. Microscope : Selection available(ESD Type available)

26. Illuminator : Selection available(ESD Type available)

27. Work Holders : Wide Selection available